{"id":4881,"date":"2026-09-08T01:09:36","date_gmt":"2026-09-08T01:09:36","guid":{"rendered":"https:\/\/ltmhp.mycafe24.com\/?post_type=insight&#038;p=4881"},"modified":"2026-10-13T01:53:23","modified_gmt":"2026-10-13T01:53:23","slug":"asps-2026-visit-report-next-generation-semiconductor-packaging-opening-with-glass-substrates-hbm-and-optical-interconnects","status":"publish","type":"insight","link":"https:\/\/ltmetal.particlecompany.co.kr\/en\/insights\/asps-2026-visit-report-next-generation-semiconductor-packaging-opening-with-glass-substrates-hbm-and-optical-interconnects\/","title":{"rendered":"ASPS 2026 Visit Report: Next-Generation Semiconductor Packaging Opening with Glass Substrates, HBM, and Optical Interconnects"},"content":{"rendered":"\n<h4 class=\"wp-block-heading\">Core Summary<\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Event Overview: The 2026 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS), held at the Suwon Convention Center from August 26 to 28, was an event to confirm the cutting edge of AI\/HPC semiconductor packaging technology.<\/li>\n\n\n\n<li>Key Topics: Glass Interposer, HBM heat management, and Optical Interconnect (CPO) technology were the main focal points to resolve data transfer bottlenecks between chips.<\/li>\n\n\n\n<li>Common Flow: Participating companies were moving towards securing mass production and cost efficiency beyond technical completion.<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h3 class=\"wp-block-heading\">Main Contents<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The keyword that ran through this exhibition was &#8216;Interconnect.&#8217; How quickly and efficiently data transfer occurs between chips and systems is becoming a core factor in AI semiconductor competitiveness.<br>Samsung Electronics and SK Hynix, leading in the memory semiconductor market, showcased different core technologies. Samsung focused on next-generation packaging and Co-Packaged Optics, while SK Hynix emphasized HBM heat management technology.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">This visit report summarizes the direction of the next-generation packaging industry shown by ASPS 2026, focusing on key exhibitor contents.<\/p>\n\n\n\n<figure class=\"wp-block-gallery has-nested-images columns-default is-cropped wp-block-gallery-1 is-layout-flex wp-block-gallery-is-layout-flex\">\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1132\" height=\"833\" data-id=\"4850\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-3.png\" alt=\"\" class=\"wp-image-4850\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-3.png 1132w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-3-300x221.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-3-768x565.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-3-1024x754.png 1024w\" sizes=\"auto, (max-width: 1132px) 100vw, 1132px\" \/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1230\" height=\"905\" data-id=\"4853\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-4.png\" alt=\"\" class=\"wp-image-4853\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-4.png 1230w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-4-300x221.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-4-768x565.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-4-1024x753.png 1024w\" sizes=\"auto, (max-width: 1230px) 100vw, 1230px\" \/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1275\" height=\"945\" data-id=\"4844\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-1.png\" alt=\"\" class=\"wp-image-4844\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-1.png 1275w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-1-300x222.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-1-768x569.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-1-1024x759.png 1024w\" sizes=\"auto, (max-width: 1275px) 100vw, 1275px\" \/><\/figure>\n<\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>1. Why is this exhibition, ASPS 2026, attracting attention?<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">As AI and HPC industries expand, the volume of data transfer between chips has surged, and traditional electrical signal methods have faced limitations in bandwidth, power, and distance. ASPS 2026 was a place where core technologies like Glass Interposer, HBM heat management, and Optical Interconnects gathered to solve these bottlenecks.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Category<\/strong><\/td><td><strong>Samsung<\/strong> <strong>Electronics<\/strong><\/td><td><strong>SK Hynix<\/strong><\/td><\/tr><tr><td><strong>Core Exhibition Fields<\/strong><\/td><td>2.3D, 3D Packaging \/ CPO<sup>1)<\/sup><\/td><td>HBM \/ Heat Management<\/td><\/tr><tr><td><strong>Key Technologies<\/strong><\/td><td><strong>2.3D Cube-E, 3D Cube-T\/H<\/strong><\/td><td>iHBM (ICE<sup>2)<\/sup>)<\/td><\/tr><tr><td><strong>Core Materials\/Structures<\/strong><\/td><td><strong>Si-Bridge, Photonic IC<\/strong><\/td><td>Core\/Base Die, TSV<\/td><\/tr><tr><td><strong>Process Efficiency<\/strong><\/td><td><strong>Shortening of inter-chip connection distance<\/strong><\/td><td>Optimization of heat dissipation paths<\/td><\/tr><tr><td><strong>Investment and cost improvement<\/strong><\/td><td>Enhancement of system design efficiency<\/td><td>Reduction of thermal resistance by over 30%<\/td><\/tr><tr><td><strong>Goals<\/strong><\/td><td><strong>CPO(Co-Packaged Optics)<\/strong><\/td><td>Full Stack AI Memory<\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">1) CPO: A next-generation packaging technology that integrates chip and optical signal modules into one package to transmit data via light instead of electrical signals.<br>2) ICE (Integrated Cooling Element): Silicon material that does not conduct electricity but has high thermal conductivity.<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>2.<\/strong> Three core highlights of ASPS 2026:<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460 Ultra-fine packaging technologies such as Chiplet and hybrid bonding<br>: You can confirm the chiplet structure that connects multiple chips into one to maximize semiconductor performance.<br>: Major companies including Samsung Electronics and SK Hynix showcase how they implement packaging solutions in real life.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2461 Next-generation game changer, &#8220;Semiconductor Glass Substrate&#8221;<br>: You can see materials and equipment technology related to glass substrates that are advantageous for microcircuit implementation, low heat generation, and large-area application.<br>: It is possible to see the commercialization stage and ecosystem development of glass substrate processing equipment and TGV technology presented by domestic and international component companies.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2462 Thermal management for high-performance AI semiconductors and related materials\/parts<br>: As AI chip development progresses, heat control has emerged as a key performance factor, increasing the importance of high-efficiency heat dissipation materials.<br>: It is possible to verify the current level of advanced packaging materials and post-processing ecosystem supporting technology for withstanding ultra-high heat environments.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>3. <\/strong>AI Memory Game Changer: Samsung&#8217;s Hyper-connection and SK Hynix&#8217;s Ultra Thermal Management<\/h3>\n\n\n\n<h4 class=\"wp-block-heading\"><strong><strong>\u25a0<\/strong> <strong>Samsung<\/strong> <strong>Electronics:<\/strong> <strong>Opening<\/strong> <strong>the<\/strong> <strong>Hyper-connection<\/strong> <strong>Era<\/strong> <strong>with<\/strong> <strong>3D<\/strong> <strong>Integration<\/strong> <strong>and CPO<\/strong><\/strong><\/h4>\n\n\n\n<figure class=\"wp-block-gallery has-nested-images columns-default is-cropped wp-block-gallery-2 is-layout-flex wp-block-gallery-is-layout-flex\">\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1066\" height=\"800\" data-id=\"4856\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-5.png\" alt=\"\" class=\"wp-image-4856\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-5.png 1066w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-5-300x225.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-5-768x576.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-5-1024x768.png 1024w\" sizes=\"auto, (max-width: 1066px) 100vw, 1066px\" \/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1256\" height=\"942\" data-id=\"4865\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-8.png\" alt=\"\" class=\"wp-image-4865\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-8.png 1256w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-8-300x225.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-8-768x576.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-8-1024x768.png 1024w\" sizes=\"auto, (max-width: 1256px) 100vw, 1256px\" \/><\/figure>\n<\/figure>\n\n\n\n<figure class=\"wp-block-gallery has-nested-images columns-default is-cropped wp-block-gallery-3 is-layout-flex wp-block-gallery-is-layout-flex\">\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1241\" height=\"931\" data-id=\"4868\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-9.png\" alt=\"\" class=\"wp-image-4868\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-9.png 1241w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-9-300x225.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-9-768x576.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-9-1024x768.png 1024w\" sizes=\"auto, (max-width: 1241px) 100vw, 1241px\" \/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1201\" height=\"900\" data-id=\"4871\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-10.png\" alt=\"\" class=\"wp-image-4871\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-10.png 1201w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-10-300x225.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-10-767x575.png 767w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-10-1024x767.png 1024w\" sizes=\"auto, (max-width: 1201px) 100vw, 1201px\" \/><\/figure>\n<\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Samsung Electronics showcased heterogeneous bonding packaging and optical interconnect technology to address data transmission limits in the AI era.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The entire process, from memory manufacturing to foundry and advanced packaging, was unified under the theme of &#8216;One-Stop Solution&#8217;, demonstrating a comprehensive semiconductor company&#8217;s capabilities.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460 Heterogeneous Integration Packaging<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">&nbsp;&nbsp; : Shorten the connection distances between chips by vertically and horizontally integrating Top Die, Bottom Die, and HBM using Si-Bridge and ISC, thereby enhancing bandwidth and reducing latency.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460-1. 2.3D Cube-E enables the horizontal integration of silicon-embedded structures like CPU, GPU, and HBM Die.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460-2. 3D Cube-T, TSV-based Vertical Stacking<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">&nbsp;&nbsp; : Supports high-density 3D IC applications such as HBM and CMOS image sensors (CIS) by applying u-Bump and Thermo Compression Bonding (TCB).<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460-3. 3D Cube-H, Bump-less Hybrid Cu Bonding<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">&nbsp;&nbsp; : Connect TSV-based logic dies directly with hybrid Cu bonding to achieve the highest level of integration and the shortest vertical signal paths.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2461 CPO (Co-Packaged Optics), Optical Interconnects<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">&nbsp;&nbsp; : Integrate Logic\u00b7Electronic IC (for computation) and Photonic IC (optical circuit chip) on top of Si Interposer, and connect optical signals directly via Fiber Array Unit to realize high-speed, low-power data transfer.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Samsung Electronics is proposing solutions for next-generation AI infrastructure by integrating chips from different processes into one system using heterogeneous integration technology.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<h4 class=\"wp-block-heading\">\u25a0 SK Hynix: iHBM Solution for Managing HBM Heat<\/h4>\n\n\n\n<p class=\"wp-block-paragraph\">In the AI accelerator era, the more stacks of HBM piled up, the greater the heat dissipation problem. SK Hynix has presented a structural solution that effectively releases this heat.<br>The core is to insert ICE (Integrated Cooling Element) between the core and base die to optimize the heat flow path.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1075\" height=\"806\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-11.png\" alt=\"\" class=\"wp-image-4874\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-11.png 1075w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-11-300x225.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-11-767x575.png 767w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-11-1024x768.png 1024w\" sizes=\"auto, (max-width: 1075px) 100vw, 1075px\" \/><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>iHBM Thermal Management Solution<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Structure: Core &amp; Base Die D2D PHY<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Goal: To alleviate localized heat concentration (Hotspot) at the junction of core and base die.<\/li>\n\n\n\n<li>Method: Place ICE (Integrated Cooling Element) vertically along the heat-generating path to quickly disperse heat upward.<\/li>\n\n\n\n<li>Effect: Compared to before applying ICE, the Hotspot temperature distribution has significantly improved, and the accuracy of SiP-level thermal simulation has also been enhanced.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>HBM Roadmap<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>2019 HBM2E (world&#8217;s first) \u2192 2021 HBM3 (world&#8217;s first) \u2192 2023 HBM3 12Hi \/ HBM3E<\/li>\n\n\n\n<li>2025.3 HBM4 \u2192 2026.6 HBM4E \u2192 2027~ Expansion of iHBM application<\/li>\n\n\n\n<li>SK Hynix aims to serve as a &#8216;Full Stack AI Memory Creator&#8217; by acting as Co-Architect, Partner, and Eco-Contributor.<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1541\" height=\"1156\" src=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-14.png\" alt=\"\" class=\"wp-image-4886\" srcset=\"https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-14.png 1541w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-14-300x225.png 300w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-14-768x576.png 768w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-14-1024x768.png 1024w, https:\/\/ltmetal.particlecompany.co.kr\/wp-content\/uploads\/2026\/10\/image-14-1536x1152.png 1536w\" sizes=\"auto, (max-width: 1541px) 100vw, 1541px\" \/><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">What the HBM4\/4E expansion models show <\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2460 We were able to confirm a structure in which the interposer and core die (1c DRAM) were precisely stacked on a 4nm logic base die.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2461 HBM4 targets AI-scale memory with x2048 I\/O, while HBM4E offers up to 16.0 Gbps bandwidth.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u2462The entire stack structure, including the package substrate that connects to the GPU, was displayed as a physical model.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Improving HBM\u2019s bandwidth and power efficiency is a key factor in expanding AI infrastructure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>4. <\/strong>Visitor Feedback<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">This ASPS 2026 site was, in one word, a &#8216;total firefight of technologies to break the limits of AI\/HPC semiconductors.&#8217;<br>Especially, Samsung Electronics and SK Hynix, the two giants of memory, presented physical models and concrete roadmaps, demonstrating Korea&#8217;s overwhelming technological prowess in semiconductors.<br>The fierce competition for dominance made this very clear.<br>Ultimately, the next battlefield for AI semiconductors is undoubtedly &#8216;Advanced Packaging&#8217;. Companies that overcome miniaturization limits and achieve mass production efficiency will lead the future AI market.<br>They will take the lead.<br>Through this visit, I was able to clearly identify the future roadmap that Korea&#8217;s semiconductor industry will carve out amid this immense trend.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Core Summary Main Contents The keyword that ran through this exhibition was &#8216;Interconnect.&#8217; How quickly and efficiently data transfer occurs between chips and systems is becoming a core factor in AI semiconductor competitiveness.Samsung Electronics and SK Hynix, leading in the memory semiconductor market, showcased different core technologies. Samsung focused on next-generation packaging and Co-Packaged Optics, [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":4843,"template":"","insight_category":[28],"class_list":["post-4881","insight","type-insight","status-publish","has-post-thumbnail","hentry","insight_category-blog-en"],"acf":[],"_links":{"self":[{"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/insight\/4881","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/insight"}],"about":[{"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/types\/insight"}],"author":[{"embeddable":true,"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/users\/2"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/media\/4843"}],"wp:attachment":[{"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/media?parent=4881"}],"wp:term":[{"taxonomy":"insight_category","embeddable":true,"href":"https:\/\/ltmetal.particlecompany.co.kr\/en\/wp-json\/wp\/v2\/insight_category?post=4881"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}