Blog&News

What is an ITO target? Core material for making transparent electrodes

What is an ITO target? Core material for making transparent electrodes While looking at smartphone screens, you might wonder about this once. Screens need to emit light, but how is electricity transmitted? Common metals conduct electricity well but block light. Conversely, glass allows light to pass through easily but hardly conducts electricity. To satisfy these […]

Continue reading

Key Technology Opening the Glass Interposer Era: TGV Cu Plating and Bridge Filling Process

Key Summary Main Content As AI and high-performance computing (HPC) advance, semiconductor packages require more signal lines packed into smaller spaces. Accordingly, Glass Interposers are emerging as a material to address the limitations of traditional organic and silicon substrates. The Glass Interposer is a thin glass layer that connects signals between chips and substrates. The […]

Continue reading

Semiconductor Sputtering Targets: Process-Specific Applications and Core Design Technologies

Executive Summary What is the Sputtering Process? The sputtering process is a type of Physical Vapor Deposition (PVD) method used in semiconductor manufacturing to deposit thin, uniform metallic or insulating films onto wafer surfaces. To understand its role simply: for the semiconductor chips embedded in essential everyday electronics like smartphones and computers to function, they […]

Continue reading

LT Metal Conducts 2026 Leadership Training for Team Leaders

LT Metal conducted the “2026 Leadership Training for Team Leaders” for all team leaders across the company. The training was designed to strengthen team leaders’ capabilities as interviewers for selecting top talent, while also enhancing their leadership skills to support team members’ performance and growth and effectively retain talented employees. The two-day training program focused […]

Continue reading